IV. Crypto Processor (CryPro) Chips

IV.1) CryPro Single-core Rocket-chip with TLS-1.3 Compatible Crypto-cores

Summary

Process ROHM-180nm
Die 5×5-mm2
Fab. Date Feb. 2022
ISA RV32IMAC
Core Rocket (×1)
Cryptography Accelerator AES-GCM, ChaCha20, Poly1305, AEAD, Ed/EC-DSA, HMAC-SHA2, RSA-1024, SHA3-512, and TRNG
Secure Boot MCU as sub-system with IBex core (RV32IMC)

Floorplan

Layout

Barechip

III. Trusted Execution Environment (TEE) Hardware Chips

III.6) TEEHW 64-bit Dual-core Rocket-Boom with Secure Boot Sub-system, Crypto-cores, and TRNG

Summary

Process ROHM-180nm
Die 5×7.5-mm2
Fab. Date Jun. 2021
ISA RV64GC
Core Rocket (×1) + Boom (×1)
Cryptography Accelerator AES, SHA3-512, Ed25519, and TRNG
Secure Boot MCU as sub-system with IBex core (RV32IMC)

Floorplan

Layout

Barechip

III.5) TEEHW 32-bit Dual-core Rocket-Boom with Secure Boot Sub-system, Crypto-cores, and TRNG

Summary

Process ROHM-180nm
Die 5×5-mm2
Fab. Date Jun. 2021
ISA RV32IMAC
Core Rocket (×1) + Boom (×1)
Cryptography Accelerator AES, SHA3-512, and TRNG
Secure Boot MCU as sub-system with IBex core (RV32IMC)

Floorplan

Layout

Barechip

III.4) TEEHW 64-bit Dual-core Rocket-chip with Crypto-cores and TRNG

Summary

Process ROHM-180nm
Die 5×5-mm2
Fab. Date Feb. 2021
ISA RV64GC
Core Rocket (×2)
Cryptography Accelerator AES, SHA3-512, Ed25519, and TRNG
Secure Boot MCU as sub-system with IBex core (RV32IMC)

Floorplan

Layout

Barechip

III.3) TEEHW 64-bit Single-core Boom with Crypto-cores

Summary

Process ROHM-180nm
Die 5×5-mm2
Fab. Date Jun. 2020
ISA RV64GC
Core Boom (×1)
Cryptography Accelerator AES, SHA3-512, and Ed25519

Layout

Barechip

III.2) TEEHW 32-bit Dual-core Rocket-Boom with Crypto-cores

Summary

Process ROHM-180nm
Die 5×5-mm2
Fab. Date Jun. 2020
ISA RV32IMAC
Core Rocket (×1) + Boom (×1)
Cryptography Accelerator AES, SHA3-512, and Ed25519

Layout

Barechip

III.1) TEEHW 64-bit Dual-core Rocket-chip with Crypto-cores

Summary

Process ROHM-180nm
Die 5×5-mm2
Fab. Date Jan. 2020
ISA RV64GC
Core Rocket (×2)
Cryptography Accelerator AES, SHA3-512, and Ed25519

Layout

Barechip

II. VexRiscv Chips

II.2) VexRiscv ROHM Chip

Summary

Process ROHM-180nm
Die 2.5×2.5-mm2
Fab. Date Jan. 2020
ISA RV32IM
Core VexRiscv (×1)

Layout

Barechip

II.1) VexRiscv SOTB Chip

Summary

Process SOTB-65nm
Die 2×1.5-mm2
Fab. Date Aug. 2019
ISA RV32IM
Core VexRiscv (×1)

Layout

Barechip

I. Freedom Chips

I.1) Freedom Quad-core Rocket-chip

Summary

Process ROHM-180nm
Die 5×7.5-mm2
Fab. Date Oct. 2019
ISA RV64GC
Core Rocket (×4)

Layout

Barechip